Understanding the Reliability Physics of Electronic and Photonic Products: Roles of Failure-Oriented-Accelerated-Tests (FOATS)
Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, USA
*Corresponding Author: E Suhir, Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, USA.
September 17, 2021; Published: November 01, 2022
The reliability bottleneck of electronic, photonic, MEMS or MOEMS (optical MEMS) systems is, as is known, the physical performance of their materials and structures  and not its functional (electrical or optical) performance. It is well known also that it is the device packaging that is the most critical undertaking, when making a viable, properly protected and effectively-interconnected device and package into a reliable product. Accelerated life testing (ALT) [2,3] conducted at different stages of an IC package design and manufacturing is the major means for achieving that. Burn-in-testing (BIT) , the chronologically final ALT, aimed at eliminating the infant mortality portion of the bathtub curve prior to shipping to the customer(s) the "healthy" products, i.e. those that survived BIT, is particularly important: BIT is an accepted practice for detecting and eliminating possible early failures in the just fabricated products.
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