E Suhir*

Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, USA

*Corresponding Author: E Suhir, Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, USA.

Received: September 17, 2021; Published: November 01, 2022

The reliability bottleneck of electronic, photonic, MEMS or MOEMS (optical MEMS) systems is, as is known, the physical performance of their materials and structures [1] and not its functional (electrical or optical) performance. It is well known also that it is the device packaging that is the most critical undertaking, when making a viable, properly protected and effectively-interconnected device and package into a reliable product. Accelerated life testing (ALT) [2,3] conducted at different stages of an IC package design and manufacturing is the major means for achieving that. Burn-in-testing (BIT) [4], the chronologically final ALT, aimed at eliminating the infant mortality portion of the bathtub curve prior to shipping to the customer(s) the "healthy" products, i.e. those that survived BIT, is particularly important: BIT is an accepted practice for detecting and eliminating possible early failures in the just fabricated products.

References

1. E Suhir. “Microelectronics and Photonics – the Future”. Microelectronics Journal11-12 (2000).
2. E Suhir. “Reliability and Accelerated Life Testing”. Semiconductor International 1, (2005).
3. E Suhir and R Mahajan. "Are Current Qualification Practices Adequate?". Circuit Assembly (2011).
4. E Suhir. “To Burn-in, or not to Burn-in: That’s the Question”. Aerospace3 (2019).
5. E Suhir. “Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable Product". Circuits Assembly, July (2013).
6. E Suhir. “Could Electronics Reliability Be Predicted, Quantified and Assured?". Microelectronics Reliability, No. 53, April 15, (2013).
7. E Suhir., et al. "Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product". 2014 IEEE Aerospace Conference, Big Sky, Montana, March (2014).
8. E Suhir. “Failure-Oriented-Accelerated-Testing (FOAT), Boltzmann-Arrhenius-Zhurkov Equation (BAZ) and Their Application in Microelectronics and Photonics Reliability Engineering”. International Journal of Aeronautical Science and Aerospace Research (IJASAR) 3 (2019).
9. E Suhir. “Probabilistic Design for Reliability”. Chip Scale Reviews6 (2010).
10. E Suhir., et al. "Probabilistic Design for Reliability (PDfR) and a Novel Approach to Qualification Testing (QT)”. 2012 IEEE/AIAA Aerospace Conf., Big Sky, Montana, (2012).
11. E Suhir. “Physics of Failure of an Electronics Product Must Be Quantified to Assure the Product's Reliability". Editorial, Acta Scientific Applied Physics1 (2021).
12. E Suhir. “Remaining Useful Lifetime (RUL): Probabilistic Predictive Model". International Journal of Prognostics-and-Health-Monitoring (PHM)2 (2011).
13. M Silverman. "Forty Years of HALT: What Have We Learned?". ASTR 2012 Oct 17-19, Toronto, (2012).
14. N Doertenbach. "The Application of Accelerated Testing Methods and Theory (HALT and HASS)". QualMark Corporation. Archived from the original on 2012-03-01.
15. E Suhir., et al. "Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov Model". Circuit Assembly, Dec. 3, (2012).
16. E Suhir and S Kang. “Boltzmann-Arrhenius-Zhurkov (BAZ) Model in Physics-of-Materials Problems”. Modern Physics Letters B (MPLB) 27 (2013).
17. E Suhir and A Bensoussan. “Application of Multi-Parametric BAZ Model in Aerospace Optoelectronics”. 2014 IEEE Aerospace Conference, Big Sky, Montana, March (2014).
18. E Suhir. “Three-Step Concept in Modeling Reliability: Boltzmann-Arrhenius-Zhurkov Physics-of-Failure-Based Equation Sandwiched Between Two Statistical Models”. Microelectronics Reliability (2014).
19. E Suhir. “Static Fatigue Lifetime of Optical Fibers Assessed Using Boltzmann-Arrhenius-Zhurkov (BAZ) Model”. Journal of Materials Science: Materials in Electronics16 (2017).
20. A Ponomarev and E Suhir. “Predicted Useful Lifetime of Aerospace Electronics Experiencing Ionizing Radiation: Application of BAZ Model”. Journal of Aerospace Engineering and Mechanics (JAEM)1 (2019).
21. E Suhir. “Boltzmann-Arrhenius-Zhurkov Equation and Its Applications In Electronic-and-Photonic Aerospace Materials Reliability-Physics Problems”. International Journal of Aeronautical Science and Aerospace Research (IJASAR), March 24, (2020).
22. E Suhir and Z Stamenkovic. “Using Yield to Predict Long-Term Reliability of Integrated Circuit (IC) Devices: Application of Boltzmann-Arrhenius-Zhurkov Model”. Solid-State Electronics 164 (2020).
23. E Suhir. “Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques”. ASME Journal of Electronic Packaging 111, June (1989).
24. E Suhir. “Analytical Thermal Stress Modeling in Electronic and Photonic Systems". ASME Applied Mechanics Reviews4 (2009).

Citation

Citation: E Suhir. “Understanding the Reliability Physics of Electronic and Photonic Products: Roles of Failure-Oriented-Accelerated-Tests (FOATS)". Acta Scientific Applied Physics 2.12 (2022): 01-03.

Copyright

Copyright: © 2022 E Suhir. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.