Acta Scientific Applied Physics

Editorial Volume 3 Issue 5

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Low Cycle Fatigue in Solder Joint Interconnections of IC Devices: Could it be Avoided?

E Suhir*

Portland State University, Portland, OR, USA; and ERS Co., 727 Alvina Ct., Los Altos, CA, USA

*Corresponding Author: E Suhir, Portland State University, Portland, OR, USA; and ERS Co., 727 Alvina Ct., Los Altos, CA, USA.

Received: March 19, 2023; Published: April 01, 2023

Abstract

Reliability physics undertakings are usually based on establishing the weakest link in the designs and technologies of importance and to make sure that this "link" is sufficiently reliable for the given device and application. Solder joint interconnections (SJIs) is the most vulnerable structural element in the IC products. It is usually perceived, that, because of the inevitable thermal contraction mismatch of the dissimilar materials in the design, it is impossible to avoid inelastic strains in it, and, because of that, also the highly damaging low cycle fatigue conditions in the solder material. Various modifications of Coffin-Manson empirical relationships are widely employed today to evaluate its useful lifetime.

References

Citation

Citation: E Suhir. “Low Cycle Fatigue in Solder Joint Interconnections of IC Devices: Could it be Avoided?". Acta Scientific Applied Physics 3.5 (2023): 01.

Copyright

Copyright: © 2023 E Suhir. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.



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