Acta Scientific Applied Physics

Editorial Volume 3 Issue 3

Reliability Physics of IC Products: Probabilistic Approach

E Suhir*

Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, CA, USA

*Corresponding Author: E Suhir, Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, CA, USA.

Received: January 27, 2023; Published: February 01, 2023


The reliability of the future electronics and photonics products, including the micro-electro-mechanical- systems (MEMS) and MOEMS (optical MEMS), will depend, first of all, on the performance of their materials, devices and packages.


  1. E Suhir. “Microelectronics and Photonics – the Future”. Microelectronics Journal11-12 (2000).
  2. E Suhir., et al. "Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product”. 2014 IEEE Aerospace Conf., Big Sky, Montana, March (2014).
  3. E Suhir. “Probabilistic Design for Reliability”. Chip Scale Reviews6 (2010).
  4. E Suhir. “Probabilistic Design for Reliability of Electronic Materials, Assemblies, Packages and Systems: Attributes, Challenges, Pitfalls”. Plenary Lecture, MMCTSE 2017, Cambridge, UK, Feb. 24-26, (2017).
  5. E Suhir. "Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable Product”. Circuits Assembly, July (2013).
  6. E Suhir and S Kang. “Boltzmann-Arrhenius-Zhurkov (BAZ) Model in Physics-of-Materials Problems”. Modern Physics Letters B (MPLB) 27 (2013).
  7. E Suhir. “To Burn-in, or not to Burn-in: That’s the Question”. Aerospace 3 (2019).
  8. E Suhir. "Analytical Bathtub Curve with Application to Electron Device Reliability”. Journal of Materials Science: Materials in Electronics9 (2015).
  9. E Suhir. "Predictive Modeling is a Powerful Means to Prevent Thermal Stress Failures in Electronics and Photonics”. Chip Scale Reviews4 (2011).


Citation: E Suhir. “Reliability Physics of IC Products: Probabilistic Approach". Acta Scientific Applied Physics 3.3 (2023): 01-02.


Copyright: © 2023 E Suhir. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.

News and Events

  • Certification for Review
    Acta Scientific certifies the Editors/reviewers for their review done towards the assigned articles of the respective journals.
  • Submission Timeline for Upcoming Issue
    The last date for submission of articles for regular Issues is July 10, 2024.
  • Publication Certificate
    Authors will be issued a "Publication Certificate" as a mark of appreciation for publishing their work.
  • Best Article of the Issue
    The Editors will elect one Best Article after each issue release. The authors of this article will be provided with a certificate of "Best Article of the Issue"
  • Welcoming Article Submission
    Acta Scientific delightfully welcomes active researchers for submission of articles towards the upcoming issue of respective journals.

Contact US