E Suhir*

Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, CA, USA

*Corresponding Author: E Suhir, Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, CA, USA.

Received: November 10, 2022; Published: November 30, 2022

Abstract

The bottleneck of an electronic, photonic, MEMS or MOEMS (optical MEMS) system's reliability is, as is known, the mechanical ("physical") performance of its materials and structural elements [1,2] and not its functional (electrical or optical) performance, as long as the latter is not affected by the mechanical behavior of the design. It is well known also that it is the packaging technology that is the most critical undertaking, when making a viable, properly protected and effectively-interconnected electrical or optical device and package into a reliable product.

References

1. E Suhir. “Microelectronics and Photonics – the Future”. Microelectronics Journal11-12 (2000): 839-851.
2. E Suhir and R Mahajan. "Are Current Qualification Practices Adequate?". Circuit Assembly (2011).
3. E Suhir. “Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests”. ASME Journal of Electronic Packaging (JEP)3 (2002).
4. E Suhir. “Reliability and Accelerated Life Testing”. Semiconductor International, Feb.1, (2005).
5. E Suhir. “Making a Viable Electron Device into a Reliable Product”. Brief Note, Journal of Electronics and Communications 5 (2020).
6. Burn-In.MIL-STD-883F: Test Method Standard, Microchips. Method 1015.9; US DoD: Washington, DC, USA, (2004).
7. E Suhir. “To Burn-in, or not to Burn-in: That’s the Question”. Aerospace3 (2019).
8. E Suhir. “Burn-in Testing (BIT): Is It Always Needed?”. IEEE ECTC, Orlando, Fl., (2020).
9. Suhir. "Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable Product". Circuits Assembly, July (2013).
10. E Suhir. "Could Electronics Reliability Be Predicted, Quantified and Assured?" Microelectronics Reliability, 53, April 15, (2013).
11. E Suhir., et al. “Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product". 2014 IEEE Aerospace Conference, Big Sky, Montana, March (2014).
12. E Suhir. “Failure-Oriented-Accelerated-Testing (FOAT), Boltzmann-Arrhenius-Zhurkov Equation (BAZ) and Their Application in Microelectronics and Photonics Reliability Engineering”. International Journal of Aeronautical Science and Aerospace Research3 (2019).
13. E Suhir. “Probabilistic Design for Reliability”. ChipScale Reviews6 (2010).
14. E Suhir., et al. “Probabilistic Design for Reliability (PDfR) and a Novel Approach to Qualification Testing (QT)”. 2012 IEEE/AIAA Aerospace Conf., Big Sky, Montana, (2012).
15. E Suhir. “Probabilistic Design for Reliability of Electronic Materials, Assemblies, Packages and Systems: Attributes, Challenges, Pitfalls”. Plenary Lecture, MMCTSE 2017, Cambridge, UK, Feb. 24-26, (2017).
16. E Suhir. “Probabilistic Design for Reliability (PDfR) of Aerospace Instrumentation: Role, Significance, Attributes, Challenges”. 5^th IEEE Int. Workshop on Metrology for Aerospace (MetroAeroSpace), Rome, Italy, Plenary Lecture, June 20-22, (2018).
17. E Suhir. "Physics of Failure of an Electronics Product Must Be Quantified to Assure the Product's Reliability". Editorial, Acta Scientific Applied Physics1 (2021).
18. E Suhir. "Could Electronics Reliability Be Predicted, Quantified and Assured?". Microelectronics Reliability, No. 53, April 15, (2013)
19. M Silverman. "Forty Years of HALT: What Have We Learned?". IEEE EPS ASTR 2012 Oct 17-19, Toronto, CA (2012).
20. "Fundamentals of HALT/HASS Testing". Keithley Instruments, Inc. Cleveland, Ohio. (2000).
21. "What is HALT HASS: Performing HALT". Qualmark Corporation (2012).
22. N Doertenbach. "The Application of Accelerated Testing Methods and Theory (HALT and HASS)". QualMark Corporation (2012).
23. E Suhir and S Kang. “Boltzmann-Arrhenius-Zhurkov (BAZ) Model in Physics-of-Materials Problems”. Modern Physics Letters B (MPLB) 27 (2013).
24. E Suhir., et al. “Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov Model". Circuit Assembly, Dec. 3, (2012).
25. E Suhir and A Bensoussan. “Application of Multi-Parametric BAZ Model in Aerospace Optoelectronics”. 2014 IEEE Aerospace Conference, Big Sky, Montana, March (2014).
26. E Suhir. "Predictive Modeling is a Powerful Means to Prevent Thermal Stress Failures in Electronics and Photonics". ChipScale Reviews 4 (2011).
27. E Suhir. “Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques”. ASME Journal of Electronic Packaging 111 (1989).
28. E Suhir. "Analytical Thermal Stress Modeling in Electronic and Photonic Systems". ASME Applied Mechanics Reviews 4 (2009).
29. E Suhir. “Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them”. IMAPS Advanced Microelectronics4 (2011).
30. E Suhir. “Could Electronics Reliability Be Predicted, Quantified and Assured?” Microelectronics Reliability7 (2013).
31. E Suhir. “Analytical Modeling Enables Explanation of Paradoxical Situations in the Behavior and Performance of Electronic Materials and Products: Review”. Journal of Physical Mathematics1 (2015).
32. E Suhir. “Analytical Modeling Occupies a Special Place in the Modeling Effort”. Journal of Physical Mathematics1 (2016).

Citation

Citation: E Suhir. “Electronic Packaging Reliability Physics, and the Role of Failure-oriented-accelerated-testing". Acta Scientific Applied Physics 2.12 (2022): 38-40.

Copyright

Copyright: © 2022 E Suhir. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.