Acta Scientific Applied Physics

Short Communication Volume 2 Issue 12

Electronic Packaging Reliability Physics, and the Role of Failure-oriented-accelerated-testing

E Suhir*

Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, CA, USA

*Corresponding Author: E Suhir, Bell Laboratories, Murray Hill, NJ (ret), Portland State University, Portland, OR, and ERS Co., Los Altos, CA, USA.

Received: November 10, 2022; Published: November 30, 2022


The bottleneck of an electronic, photonic, MEMS or MOEMS (optical MEMS) system's reliability is, as is known, the mechanical ("physical") performance of its materials and structural elements [1,2] and not its functional (electrical or optical) performance, as long as the latter is not affected by the mechanical behavior of the design. It is well known also that it is the packaging technology that is the most critical undertaking, when making a viable, properly protected and effectively-interconnected electrical or optical device and package into a reliable product.


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Citation: E Suhir. “Electronic Packaging Reliability Physics, and the Role of Failure-oriented-accelerated-testing". Acta Scientific Applied Physics 2.12 (2022): 38-40.


Copyright: © 2022 E Suhir. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.

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